Microscope image of electromigration-induced hillock and void
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Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals
Electromigration Reliability in Ag Lines Printed with Nanoparticle Inks: Implications for Printed Electronics
Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study - Wei Yao, Cemal Basaran, 2014
A Review of the Study on the Electromigration and Power Electronics
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration - ScienceDirect
Electromigration - an overview
Electromigration-Induced Plasticity in Cu Interconnects: The Length Scale Dependence
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
PDF) Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth
Hillock and void formations in wires due to electromigration (Photo
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density - ScienceDirect
3.7.1 Electro-Migration
Micrographs of a 5 m wide Al ͑ Cu ͒ line: ͑ a ͒ before and ͑ b ͒
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